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50MHz to 1000MHz High-Linearity, Serial/
Parallel-Controlled Analog/Digital VGA
ABSOLUTE MAXIMUM RATINGS
VCC_ to GND ........................................................-0.3V to +5.5V
VDD_LOGIC, DATA, CS , CLK, SER/PAR, VDAC_EN,
VREF_SELECT.....................................-0.3V to (VCC_ + 0.3V)
STATE_A, STATE_B, D0–D4 ....................-0.3V to (VCC_ + 0.3V)
AMP_IN, AMP_OUT, VREF_IN,
ANALOG_VCTRL ................................-0.3V to (VCC_ + 0.3V)
ATTEN1_IN, ATTEN1_OUT, ATTEN2_IN,
ATTEN2_OUT...................................................-1.2V to + 1.2V
RSET to GND........................................................-0.3V to + 1.2V
RF Input Power (ATTEN1_IN, ATTEN1_OUT,
ATTEN2_IN, ATTEN2_OUT).......................................+20dBm
RF Input Power (AMP_IN)...............................................+18dBm
Continuous Power Dissipation (Note 1) ...............................6.5W
θ JA (Notes 2, 3)..............................................................+38°C/W
θ JC (Note 3) ...................................................................+10°C/W
Operating Temperature Range (Note 4) .....T C = -40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature.........................................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Based on junction temperature T J = T C + ( θ JC x V CC x I CC ). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a printed-circuit board (PCB). See the Applications Information section
for details. The junction temperature must not exceed +150°C.
Note 2: Junction temperature T J = T A + ( θ JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, high-current (HC) mode, V CC = +3.0V to +3.6V, T C = -40°C to +85°C. Typical values are at V CC = +3.3V
and T C = +25°C, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
MIN
3.0
TYP
3.3
60
MAX
3.6
80
UNITS
V
mA
LOGIC INPUTS (DATA, CS , CLK, VDAC_EN, VREF_SELECT, SER/PAR, STATE_A, STATE_B, D0 – D4)
Input High Voltage
Input Low Voltage
V IH
V IL
2
0.8
V
V
+5V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V CC = +4.75V to +5.25V, T C = -40°C to +85°C. Typical values are at V CC = +5V and
T C = +25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
Supply Current
V CC
I CC
Low-current (LC) mode
High-current (HC) mode
4.75
5
73
124
5.25
93
146
V
mA
LOGIC INPUTS (DATA, CS , CLK, VDAC_EN, VREF_SELECT, SER/PAR, STATE_A, STATE_B, D0 – D4)
Input High Voltage
Input Low Voltage
V IH
V IL
3
0.8
V
V
Input Current Logic-High
Input Current Logic-Low
I IH
I IL
-1
-1
+1
+1
μA
μA
2
_______________________________________________________________________________________
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